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PCDFCA February 2013 : Cover 1

Reliability Improvement Costs | HDPUG | Footprints Accuracy pcdan n df nd f.c .c co m circuitsassembly l y .co o m February F b 2013 20 13 PRINTED CIRCUIT DESIGN & FAB TOP-DOWN PB-FREE MANAGEMENT How the Design and Assembly Rules Have Changed DDR3 and DDR4 Interface Designs Reducing Flex Assembly Thickness Selective Soldering Double Row Headers Special: IPC Apex Expo Show Issue


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