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PCDFCA July 2011 : Page 8

AROUND THE WORLD EDITED BY MIKE BUETOW Users Updating, Adopting IPC Data Transfer Spec PCD&F People P . D. Circuits named Deb Gerardi customer service manager. She has 25 years’ experience in sales and customer service with San-mina-SCI and other companies. Lenthor Engineering named Melinda Wallace customer service specialist. Enthone Asia named Robert Haskins senior vice president and regional managing director. He has 20 years’ industry expe-rience, most recently as presi-dent of Isola’s Asia operations. Maskless Lithography named former Fox-conn executive Richard Chenoweth vice president of global sales and market-ing, and former Sanmina-SCI executive William Pappani chief financial officer. RBP Chemical named Adam Meaux technical service man-ager. He has five years’ experi-ence in product development and customer support in all wet process areas related to printed circuit board manufacturing. Prototron named Robert Zippo to its sales team. Park Electrochemical promoted Christo-pher Mastrogiacomo to executive vice president and COO. BOLTON, MA – Electronic data transfer formats, vital as they are, are guaranteed to PCD&F Briefs PCD&F is accepting entries for its Fall 2011 New Product Introduction Award (NPI) for PCB design software suppliers. The NPI Award recognizes the leading new products for PWB design introduced this calendar year. The deadline for entries is July 28. For information, visit pcdandf.com/cms/compo-nent/content/category/229-npi-award. PCB fabricators Unimicron Technol-ogy, Unitech Printed Circuit Board and Compeq plan to ramp capacities for any layer HDI boards in 2011 to cope with increasing demand from HTC . Lattice Semiconductor (lattice.com) named Digi-Key (digikey.com) as a global distributor. Mitsui Metal (mitsui-kinzoku.co.jp) will build a copper foil manufacturing line in Malaysia with a monthly capacity of 600,000 sq. m. Shocking Technologies (shockingtechno-logies.com) certified Multek (multek.com) on its ESD protection material. elicit yawns, if not outright derision, from users. But that history isn’t deterring an industry task group from attempting to tackle the now three-decades-old problem of unintelligent schematic files. Three standards are generally used for data transfer: OBD++, which is favored by fabricators; IPC-2581 (formerly GenCAM), which is more common at the assembly and test level; and Gerber, the age-old format that most companies despise for its lack of intelligence, but no one seems able to kill. Mentor Graphics’ (mentor.com) acquisition last year of Valor, the author of ODB++, has affected the industry outlook for that format. Mentor has no plans to cease support for ODB++, the company told PCD&F. Some users, however, are calling for greater use of the IPC standard, in part to hedge against other formats becoming obsolete as new technologies are introduced. IPC-2581, which was published in February 2004, is an industry consensus specification but is not altogether common for CAD-CAM file transfers. That might change soon, though, as major EMS companies and defense contractors such as Sanmina-SCI and Lockheed Martin are supporting the new standard. The IPC task group charged with keeping the standard current met in late June at the suburban Boston offices of DownStream Technologies (downstreamtech.com) to finalize the spec for industry review. Unlike past attempts such as IPC-D-350 and GenCAM, which often were hampered by vendor resistance, attendees think this effort might take hold because Gerber won’t accommodate new technologies. Today, even with embedded components, people are working around them to still use Gerber,” said DownStream president Rick Almeida. “The question is, how much complexity and pain is involved? The technology is pushing the standard. Embedded components are still cutting-edge, but they could be a limiting factor.” Among the attendees at the meeting were representatives from Sanmina-SCI (Sanmi-na-sci.com), Ericsson (ericsson.com), Cadence (cadence.com) and Zuken (zuken.com). Zuken already offers IPC-2581 output for certain customers. “Lockheed asked for it, and they obviously are an important customer to us,” director of product marketing Steve Chidester told PCD&F. “Our intention is to support IPC-2581 and to put it out.” “I think [the work on IPC-2581] is being driven both by vendors and by the customers,” said Almeida. “ODB++ essentially is a manufacturing standard that has been extrapolated into a data standard. If we make [IPC-2581] better, we have a shot at really good data exchange.” – MB Cadence Collaboration Nets 3D Stacked IC Test Solution SAN JOSE – Cadence (cadence.com) has teamed with a top nanoelectronics research institute to launch an automated test solution for 3D stacked ICs. The collaboration with Belgium-based Imec (www2.imec.be) provides design-for-test (DfT) and automatic test pattern generation technology said to ease testing of 3D-ICs with through-silicon via (TSV) functionality. The technology addresses the test challenges involved with 3D-ICs, which offer increased circuit density and better performance at lower power dissipation in a smaller footprint. Insights gained during a comprehensive research program on TSV-based 3D-IC design and technology enabled Imec to extend the DfT architecture for conventional ICs with several pat-ent-pending features. The 3D DfT architecture is based on the concept of die-level test wrap-pers, which enable testing of chips with TSVs and micro-bumps both before (“pre-bond test”), during (“mid-bond test”), and after (“post-bond test”) stacking, as well as after packaging. “This new DfT solution is the latest example of our commitment to the emerging area of 3D-IC,” said Brion Keller, senior architect at Cadence. “Over the past two years, we’ve intro-duced 3D-IC TSV and silicon interposer capabilities, and just months ago, the industry’s first wide I/O memory controller IP solution, with a robust 3D-IC integration environment.” – MB JULY 2011 8 PRINTED CIRCUIT DESIGN & FAB / CIRCUITS ASSEMBLY

Around The World

Mike Buetow

PCD&F People<br /> <br /> P. D. Circuits named Deb Gerardi customer service manager. She has 25 years’ experience in sales and customer service with Sanmina- SCI and other companies. Lenthor Engineering named Melinda Wallace customer service specialist.<br /> <br /> Enthone Asia named Robert Haskins senior vice president and regional managing director.He has 20 years’ industry experience, most recently as president of Isola’s Asia operations.<br /> <br /> Maskless Lithography named former Foxconn executive Richard Chenoweth vice president of global sales and marketing, and former Sanmina-SCI executive William Pappani chief financial officer.<br /> <br /> RBP Chemical named Adam Meaux technical service manager.He has five years’ experience in product development and customer support in all wet process areas related to printed circuit board manufacturing.<br /> <br /> Prototron named Robert Zippo to its sales team.<br /> <br /> Park Electrochemical promoted Christopher Mastrogiacomo to executive vice president and COO.<br /> <br /> PCD&F Briefs<br /> <br /> PCD&F is accepting entries for its Fall 2011 New Product Introduction Award (NPI) for PCB design software suppliers. The NPI Award recognizes the leading new products for PWB design introduced this calendar year. The deadline for entries is July 28. For information, visit pcdandf.com/cms/component/ content/category/229-npi-award.<br /> <br /> PCB fabricators Unimicron Technology, Unitech Printed Circuit Board and Compeq plan to ramp capacities for any layer HDI boards in 2011 to cope with increasing demand from HTC.<br /> <br /> Lattice Semiconductor (lattice.com) named Digi-Key (digikey.com) as a global distributor.<br /> <br /> Mitsui Metal (mitsui-kinzoku.co.jp) will build a copper foil manufacturing line in Malaysia with a monthly capacity of 600,000 sq. m.<br /> <br /> Shocking Technologies (shockingtechnologies.Com) certified Multek (multek.com) on its ESD protection material. Electronic Interconnect (eiconnect.com) named Meridian Marketing (meridianmktg.Com) its rep in Colorado, Utah, Wyoming, Montana and southern Idaho.<br /> <br /> PCB materials maker Ohmega Technologies (ohmega.com) named Spectra Innovations (spectraind.com) its distributor in India.<br /> <br /> CIRCUITS ASSEMBLY People<br /> <br /> Seika Machinery has promoted Isao Muraoka (pictured) to president and CEO and Koichi Koba to executive vice president.Muraoka had been general manager and executive vice president since 2006.<br /> <br /> AIM promoted David Suraski to executive vice president, assembly materials division.<br /> <br /> Nortech Systems named Jill D. Hesselroth vice president of global supply chain.<br /> <br /> EMS firm The Morey Corp. promoted Vincent Petrella to president, while Scott Morey remains CEO. Paul Callaghan will replace Petrella as CFO.<br /> <br /> Ellsworth Adhesives named Sergio Patricio engineering sales representative for its Latin America subsidiary.<br /> <br /> Manncorp named Humberto E. Bojórquez national sales manager, Mexico. He is a graduate of Pan American University and has extensive experience in SMT.<br /> <br /> Fabrico named Mark White technical sales representative, printing applications.<br /> <br /> EMS firm Herald Electronics named Richard Brighton managing director.<br /> <br /> Absolute Turnkey named Eric Butler sales manager.<br /> <br /> CIRCUITS ASSEMBLY Briefs<br /> <br /> The Electronic Components Industry Association (eciaonline.org) has updated its guidelines for reporting distributor sales information to manufacturers.<br /> <br /> EMS firm SenDEC Corp. (sendec.com) opened a 20,000 sq. ft. NPI facility in Fairport, NY.<br /> <br /> Cytec Conap (cytec.com) named Ellsworth Adhesives to distribute its potting compounds and conformal coatings in Thailand, Australia and New Zealand.<br /> <br /> Foxconn’s (foxconn.com) manufacturing site in Nitra, Slovakia, has been inspected for noncompliance with labor laws. Yamaha (yamaha.com) sold its 30,000th surface mount placement machine.<br /> <br /> Legacy Electronics (legacyelectronics.com) has completed Phase 1 of its move from San Clemente, CA, to Sioux Falls, SD.<br /> <br /> Mirtec Europe (mirteceurope.com) named LTHD Corp. (lthd.com) as representative in Romania.<br /> <br /> Action Circuits (UK) (actioncircuits.com) purchased its third BPM Microsystems (bpmmicro.com) 4710 automated programming system.<br /> <br /> EPIC Technologies (epictech.com) has entered into an exclusive joint marketing and manufacturing agreement with Rocket EMS (rocketems.com).<br /> <br /> Juki (jukiamericas.com) named MaRC Technologies (marctechnologies.com) as representative for the Pacific Northwest US.<br /> <br /> Koh Young (kohyoung.com) named Scanditron (scanditron.com) its distributor in Scandinavia. The inspection equipment OEM also launched a US base for operations, sales, service, and support for North American customers.<br /> <br /> Automated Circuit Design (acd.biz) has ordered two Juki (jukiamericas.com) IFSX2 intelligent feeder platforms. The EMS firm also implemented PhaseWare Event Tracking Software.<br /> <br /> Computrol (computrol.com) purchased 12 CD soldering stations from JBC Tools (jbctools.com).<br /> <br /> EMS firm Kitron (kitron.com) selected Aegis’ (aiscorp.com) Manufacturing Operations Software.<br /> <br /> JBC Tools (jbctools.com) appointed Horizon Sales (horizonsales.com) representative in Michigan, Ohio, Indiana, Kentucky and Western Pennsylvania.<br /> <br /> Kiva Systems (kivasystems.com) ordered 140 Cognex (cognex.com) DataMan 500 barcode readers.<br /> <br /> Speedprint (speedprint-tech.com) has appointed Tool Technology its manufacturers’ representative in Missouri, Nebraska, Iowa and Kansas, and FHP Reps (fhpreps.Com) its representative in Arizona, New Mexico and Nevada.<br /> <br /> Nordson (nordson.com) opened a new demo center in Dongguan for products from Asymtek, Dage and YESTech.<br /> <br /> DfR Solutions (dfrsolutions.com) named TSI its representative in North America.<br /> <br /> EMS firm Texatronics has closed its operations outside Dallas and will auction the equipment.<br /> <br /> Users Updating, Adopting IPC Data Transfer Spec<br /> <br /> BOLTON, MA – Electronic data transfer formats, vital as they are, are guaranteed to elicit yawns, if not outright derision, from users. But that history isn’t deterring an industry task group from attempting to tackle the now three-decades-old problem of unintelligent schematic files.<br /> <br /> Three standards are generally used for data transfer: OBD++, which is favored by fabricators; IPC-2581 (formerly GenCAM), which is more common at the assembly and test level; and Gerber, the age-old format that most companies despise for its lack of intelligence, but no one seems able to kill.<br /> <br /> Mentor Graphics’ (mentor.com) acquisition last year of Valor, the author of ODB++, has affected the industry outlook for that format. Mentor has no plans to cease support for ODB++, the company told PCD&F. Some users, however, are calling for greater use of the IPC standard, in part to hedge against other formats becoming obsolete as new technologies are introduced.<br /> <br /> IPC-2581, which was published in February 2004, is an industry consensus specification but is not altogether common for CAD-CAM file transfers. That might change soon, though, as major EMS companies and defense contractors such as Sanmina-SCI and Lockheed Martin are supporting the new standard.<br /> <br /> The IPC task group charged with keeping the standard current met in late June at the suburban Boston offices of DownStream Technologies (downstreamtech.com) to finalize the spec for industry review. Unlike past attempts such as IPC-D-350 and GenCAM, which often were hampered by vendor resistance, attendees think this effort might take hold because Gerber won’t accommodate new technologies.Today, even with embedded components, people are working around them to still use Gerber,” said DownStream president Rick Almeida. “The question is, how much complexity and pain is involved? The technology is pushing the standard. Embedded components are still cutting-edge, but they could be a limiting factor.”<br /> <br /> Among the attendees at the meeting were representatives from Sanmina-SCI (Sanmina- sci.com), Ericsson (ericsson.com), Cadence (cadence.com) and Zuken (zuken.com). Zuken already offers IPC-2581 output for certain customers. “Lockheed asked for it, and they obviously are an important customer to us,” director of product marketing Steve Chidester told PCD&F. “Our intention is to support IPC-2581 and to put it out.” <br /> <br /> “I think [the work on IPC-2581] is being driven both by vendors and by the customers,” said Almeida. “ODB++ essentially is a manufacturing standard that has been extrapolated into a data standard. If we make [IPC-2581] better, we have a shot at really good data exchange.” – MB<br /> <br /> Cadence Collaboration Nets 3D Stacked IC Test Solution<br /> <br /> SAN JOSE – Cadence (cadence.com) has teamed with a top nanoelectronics research institute to launch an automated test solution for 3D stacked Ics.<br /> <br /> The collaboration with Belgium-based Imec (www2.imec.be) provides designfor- test (DfT) and automatic test pattern generation technology said to ease testing of 3D-ICs with through-silicon via (TSV) functionality. The technology addresses the test challenges involved with 3D-ICs, which offer increased circuit density and better performance at lower power dissipation in a smaller footprint.<br /> <br /> Insights gained during a comprehensive research program on TSV-based 3D-IC design and technology enabled Imec to extend the DfT architecture for conventional Ics with several patent- pending features. The 3D DfT architecture is based on the concept of die-level test wrappers, which enable testing of chips with TSVs and micro-bumps both before (“pre-bond test”), during (“mid-bond test”), and after (“post-bond test”) stacking, as well as after packaging.<br /> <br /> “This new DfT solution is the latest example of our commitment to the emerging area of 3D-IC,” said Brion Keller, senior architect at Cadence. “Over the past two years, we’ve introduced 3D-IC TSV and silicon interposer capabilities, and just months ago, the industry’s first wide I/O memory controller IP solution, with a robust 3D-IC integration environment.” – MB<br /> <br /> EU Extends RoHS Coverage<br /> <br /> BRUSSELS – The Council of the European Union revised the directive on hazardous substances in electrical and electronic equipment, extending protection from dangerous chemicals to more electrical appliances, and improving the safety of products such as mobile phones, refrigerators and electronic toys.<br /> <br /> First adopted in 2003, the law bans six hazardous substances in electrical and electronic equipment, including lead, mercury and cadmium.<br /> <br /> The review extends the scope of the ban to more products, now in principle applying to all electrical and electronic equipment, as well as to cables and spare parts. Monitoring and control devices and medical devices will be covered in three years, in vitro medical devices in five years, and industrial control appliances in six years. Photovoltaic panels to produce energy from solar light do not have to comply with the restriction.<br /> <br /> The new law obliges the commission to regularly review and adapt the list of restricted substances according to a number of criteria; further substances in electrical and electronic equipment may be banned in the future.<br /> <br /> The revised act will enter into force shortly after its publication in the Official Journal of the EU and must be transposed into national law within 18 months. – CD<br /> <br /> NI to Acquire EDA Firm AWR<br /> <br /> AUSTIN, TX – National Instruments (ni.com) has signed a definitive agreement to acquire AWR (awrcorp.com), a supplier of electronic design automation software for RF and high-frequency components and systems, for $58 million.<br /> <br /> The transaction is expected to close by mid July. Upon closing, AWR will operate as a wholly owned subsidiary under its current management team. The aggregate purchase price includes $7 million in AWR’s cash on hand.<br /> <br /> NI said the deal will enhance the integration between AWR’s design tools and NI’s software and hardware, improving design, validation and production test.<br /> <br /> “AWR has an exceptional team with strong RF talent and technologies that expand the NI platform into RF design, which is complementary to our capability to make measurements across the RF design flow,” said Dr. James Truchard, president, CEO and cofounder of National Instruments. “We believe this combination will accelerate the deployment of RF and wireless technologies and offers a significant benefit to the customers of both companies.” – MB<br /> <br /> New Report Highlights Looming Changes in Flip Chip Attach<br /> <br /> PARIS – Gold bumping may be the preferred attachment method for flip chip today, but that’s not going to be the case much longer, a new research report says.<br /> <br /> Gold bumping will be overtaken due to a slowdown in growth of the primary product it is used for – LCD driver Ics – and the high raw material cost, Yole Développement (yole.fr) says. In its place, copper pillar bumping will jump from the second most popular flip chip attachment method. Cu bumping is preferred by Intel, the world leader in wafer bumping capacity.<br /> <br /> Other methods, including tin-lead and lead-free solder bumping, are less significant in terms of popularity, Yole said in a June 16 webinar. Yole, which is releasing a research report on flip chip market and technologies, noted lead will be banned in 2014, boosting Cu pillar. “The next big technology is clearly going to be Cu pillar,” said Jean-Marc Yannou, a project manager with Yole (see related article, page 17).<br /> <br /> At stake is a big market: Total flip chip sales, including assembly, packaging and test, reached $16 billion in 2010, Yole said, good for 29% of the worldwide IC market. Of that, assembly made up 14% and final test 17%. Yole estimates $5.4 billion worth of PCB substrates were used for flip chip in 2010, with BT and FR-4 materials (at less than $2 billion in 2010) the main materials.<br /> <br /> Fabricators and assemblers of plated bumps or rigid organic substrates designed for flip chips have much to look forward to over the next few years. Yole forecasts Package unit sales will grow 19.6% compounded annually between 2010 and 2016.<br /> <br /> The top-end markets for flip chips are computing and telecom, in that order, but that is changing, Yole said. As of this year, the firm expects telecom to surpass computing. Other markets, including consumer, industrial, automotive and military/aerospace, are considerably small in terms of value. Nevertheless, flip chip has been used in the automotive sector for years, primarily on ceramic substrates, where it is preferred for its stability. “It is sometimes better than wire bonding for reliability and electromigration,” noted Yannou.<br /> <br /> As noted, Intel maintains the lead in wafer bumping capacity, followed by Chip- Bond, TSMC, Samsung, NEPES and ASE. By geography, Taiwan holds the greatest share with 38%, followed by the US (24%) and Korea (17%).<br /> <br /> One newer trend Yole sees is use of flip chip for memory, albeit the overall volume remains low. While still rare, Yannou said, DRAMs used for GPUs were first produced in significant volumes late last year. “It’s been forecasted by some, [and] we do think there will be more of these, but as of today, it’s not significant.” – MB<br /> <br /> Foxconn Consolidates N. American Ops in Mexico<br /> <br /> SAN JERONIMO, MEXICO – Foxconn (fih-holdings.com) plans to consolidate its North American operations at its 1.6 million sq. ft. Manufacturing plant here, according to published reports. The facility currently includes 400,000 sq. ft. Of additional manufacturing space. Foxconn owns 240 hectares in the city. The plant employs 5,500 workers.<br /> <br /> The decision to consolidate operations in San Jeronimo came as a result of its closeness to important markets in the US, the firm says, in addition to an accessible labor pool in Juárez. Foxconn also reportedly wants some China customers to relocate to Mexico after the real estate market improves.<br /> <br /> Construction of a facility not owned by the electronics manufacturer has reportedly begun next to the Foxconn factory, which is expected to aid in further industrial growth in the region. – CD<br /> <br /> KleinPartners Bringing Rollup Strategy to EMS<br /> <br /> BRADENTON, FL – One year after acquiring Creonix, KleinPartners Capital plans at least three more deals over the next two years. The private investment group bought the EMS firm in March 2010, then snatched up fellow printed circuit board assembler MSI of Central Florida at auction last fall.<br /> <br /> Creonix (creonixllc.com) plans to make at least two acquisitions in 2011 and a third in 2012, company president Ken Piela told a local newspaper. KleinPartners (kleinpartners.com) is the sole owner of Creonix.<br /> <br /> The moves echo KleinPartners’ strategy in the bare board space, where the firm acquired several small PCB fabricators on the cheap, then closed most of the facilities and consolidated the manufacturing in a few plants, a move known as a rollup.The firm focuses on family-run, often distressed companies. Among the acquisitions over the past several years were Epec, FM Circuits, Waytec, Marlo Electronics, Excel Electrocircuit and Beaver Brook Circuits.<br /> <br /> The strategy has left some companies unhappy with KleinPartners, however.One longtime EMS company told CIRCUITS ASSEMBLY the firm was brought on as a consultant with the understanding it would invest in the company, then backtracked on its promises. (CIRCUITS ASSEMBLY has no proof of the allegation.)<br /> <br /> KleinPartners’ interest in EMS reflects a wider trend, analysts say. According to Ray Carpenter, director and head of electronics supply chain investment banking at Southwest Securities, EMS M&A are on the upswing, with private equity taking a greater interest in smaller and niche firms. Per Carpenter, 91% of the total EMS transactions last year involved Tier III or IV firms. – MB

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